LOCTITE ABLESTIK ABP 2036SF

LOCTITE ABLESTIK ABP 6892, BMI/Acrylate, Die Attach, Non-conductive Paste LOCTITE® ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package using this material will have a greater resistance to delamination and overall improvement in package reliability

• Non-conductive
• Halogen free
• Snap curable
• Low cure temperature

Application Method	Dispense System
Applications	Die Attach
Color	Red
Cure Type	Heat Cure
Filler Type	Silica
Glass Transition Temperature (Tg)	125.0 °C
Hot Die Shear Strength, @ 150.0 °C 2 x 2 mm Si die on PPF leadframe	1.6 kg-f
Key Characteristics	Conductivity: Electrically Non-Conductive, Cure Speed: Fast Cure, Stress: Low Stress
Number of Components	1 Part
Physical Form	Paste
RT Die Shear Strength, 2 x 2 mm Si die on PPF leadframe	12.0 kg-f
Substrates	LeadFrame: Gold
Technology	Hybrid Chemistry
Tensile Modulus, @ 250.0 °C	55.0 N/mm² (8180.0 psi )
Thermal Conductivity	0.35 W/mK
Thixotropic Index	4.42
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	12760.0 mPa·s (cP)