LOCTITE ABLESTIK 965-1L

LOCTITE ABLESTIK 965-1L, Epoxy, Die attach LOCTITE® ABLESTIK 965-1L is designed for bonding large die integrated circuits with mismatched coefficients of thermal expansion. It is designed for high speed, automated assembly operations.

• Electrically conductive
• Stress absorbing
• Low levels of contaminants
• Void-free bondline with minimal bleed

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	50.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	190.0 ppm/°C
Color	Silver
Cure Schedule, @ 150.0 °C	1.0 hr.
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	72.0 °C
Hot Die Shear Strength, 2 x 2 mm (80 x 80 mil) Si die on Ag/Cu LF	0.6 kg-f
RT Die Shear Strength, 2 x 2 mm (80 x 80 mil) Si die on Ag/Cu LF	10.0 kg-f
Thermal Conductivity	3.0 W/mK
Thixotropic Index	4.5
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	12000.0 mPa·s (cP)
Volume Resistivity	≤ 0.0005 Ohm cm