LOCTITE ABLESTIK 8387B

LOCTITE ABLESTIK 8387B, Epoxy, Die Attach, Non-Conductive Adhesive LOCTITE® ABLESTIK 8387B non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This adhesive can be fast cured using directed heat energy or hot plate curing techniques. In conventional box or convection conveyor oven curing, it will cure at temperatures as low as 100ºC. Please refer to the TDS for alternate cure schedules.

• Black pigmentation for blocking stray light
• Non-conductive
• Fast cure

Application Method	Dispense System
Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	94.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	165.0 ppm/°C
Color	Black
Cure Schedule, @ 150.0 °C	2.0 min.
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	299.0 ppm
Extractable Ionic Content, Potassium (K+)	4.0 ppm
Extractable Ionic Content, Sodium (Na+)	9.0 ppm
Glass Transition Temperature (Tg)	96.0 °C
Hot Die Shear Strength, @ 250.0 °C 12.7 x 12.7 mm Si die on Cu LF	270.0 kg-f
Key Characteristics	Conductivity: Electrically Non-Conductive, Cure Speed: Fast Cure
Number of Components	1 Part
Physical Form	Paste
RT Die Shear Strength, 3 x 3 mm Si die on Cu LF @ 25°C	4400.0 psi
Substrates	Laminate, LeadFrame: Silver
Technology	Epoxy
Tensile Modulus, DMTA @ 250.0 °C	53.0 N/mm² (7700.0 psi )
Thixotropic Index	4.5
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	9500.0 mPa·s (cP)