LOCTITE ABLESTIK 2035SC

LOCTITE ABLESTIK 2035SC, Proprietary Hybrid Chemistry, Die Attach, Non-Conductive Adhesive LOCTITE® ABLESTIK 2035SC non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces.

• Non-conductive
• Single component
• Fast cure
• Low cure temperature

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	54.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	128.0 ppm/°C
Cure Schedule, Recommended @ 110.0 °C	90.0 sec.
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	29.0 ppm
Extractable Ionic Content, Potassium (K+)	19.0 ppm
Extractable Ionic Content, Sodium (Na+)	89.0 ppm
Glass Transition Temperature (Tg)	120.0 °C
Hot Die Shear Strength	7.0 kg-f
Key Characteristics	Conductivity: Electrically Non-Conductive
RT Die Shear Strength	25.0 kg-f
Tensile Modulus, DMTA @ 25.0 °C	68.0 N/mm² (10000.0 psi )
Thermal Conductivity	0.35 W/mK
Thixotropic Index	4.2
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	11000.0 mPa·s (cP)