LOCTITE ECCOBOND F 202

LOCTITE ECCOBOND F 202, Epoxy, Component assembly, NCA LOCTITE® ECCOBOND F 202 epoxy adhesive is recommended for photonic applications exposed to high temperatures. This material exhibits low exotherm during its short cure cycle and, for most applications, does not require degassing.

• Two component
• Low viscosity
• Low exotherm
• 100% Solids

Cure Schedule, Alternate @ 140.0 °C	1.0 hr.
Cure Schedule, Recommended @ 125.0 °C	2.0 hr.
Cure Type	Heat Cure
Number of Components	2 Part
Operating Temperature	-60.0 - 265.0 °C
Shear Strength, Aluminum	3000.0 psi
Storage Temperature	27.0 °C
Substrates	Metal
Technology	Epoxy
Mixed
Viscosity, Mixed @ 25.0 °C	1000.0 mPa·s (cP)