LOCTITE ABLESTIK 958-11 Így ismerik: ABLESTIK ABLEBOND 958-11

LOCTITE ABLESTIK 958-11, Epoxy, Die attach LOCTITE® ABLESTIK 958-11 adhesive is designed to absorb stresses produced when bonding large ICs.

• Non-conductive
• Stress absorbing

Applications	Die Attach
Cure Schedule, @ 130.0 °C	2.0 hr.
Cure Type	Heat Cure
Number of Components	1 Part
Shear Strength, Aluminum	2700.0 psi
Storage Temperature	-40.0 °C
Technology	Epoxy
Viscosity, @ 25.0 °C	45000.0 mPa·s (cP)