LOCTITE ABLESTIK 813J01 BIPAX

LOCTITE ABLESTIK 813J01 BIPAX, Silicone, Non-corrosive, Encapsulant LOCTITE® ABLESTIK 813J01 BIPAX exhibits very low stress upon cure thus preventing component cracking and other stress-related problems. This adhesive can be cured at room temperature in thick or thin sections. It is non-corrosive and will not revert when exposed to high temperatures.

• Excellent thermal conductivity
• Bonds well to difficult substrates
• Low stress

Applications	Encapsulating
Cure Schedule, @ 25.0 °C	2.0 - 7.0 day
Cure Type	Room Temperature (Ambient) Cure
Number of Components	1 Part
Shear Strength, Aluminum	500.0 psi
Storage Temperature	25.0 °C
Technology	Silicone
Viscosity	40000.0 mPa·s (cP)