LOCTITE ABLESTIK 2025DSI

LOCTITE ABLESTIK 2025DSI, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2025DSI die attach adhesive is designed for use in array packaging.

• Non-conductive
• High reliability
• Improved work life

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	55.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	145.0 ppm/°C
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	-34.0 °C
Thermal Conductivity	0.4 W/mK
Thixotropic Index	5.0
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	11500.0 mPa·s (cP)