LOCTITE 3129

LOCTITE 3129, Epoxy, Bonding heat sensitive components LOCTITE® 3129 is a one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies. Particularly suited where low curing temperatures are required for heat sensitive components.

• One component - requires no mixing
• Medium viscosity

Casson Viscosity, Cone & Plate Haake PK100, PK1, 2°, @ 25.0 °C	4200.0 mPa·s (cP)
Cure Schedule, @ 80.0 °C	5.0 - 10.0 min.
Cure Type	Heat Cure
Number of Components	1 Part
Shear Strength	2230.0 psi
Storage Temperature	-15.0 - -25.0 °C
Technology	Epoxy
Viscosity, Cone & Plate Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 2 s⁻¹	46000.0 mPa·s (cP)
Viscosity, Cone & Plate Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 20 s⁻¹	12000.0 mPa·s (cP)
Yield Point	39000.0 mPa·s