LOCTITE ABLESTIK 84-1LMI Így ismerik: ABLEBOND 84-1LMI

LOCTITE ABLESTIK 84-1LMI, Epoxy, Die attach LOCTITE® ABLESTIK 84-1LMI die attach adhesive is designed for microelectronic chip bonding applications. This adhesive is ideal for application by automatic dispenser or hand probe.

• Electrically conductive
• Low bleed
• Low outgassing

Applications	Die Attach
Cure Schedule, @ 150.0 °C	1.0 hr.
Cure Type	Heat Cure
Number of Components	1 Part
Physical Form	Paste
Shear Strength, Aluminum	1500.0 psi
Storage Temperature	-40.0 °C
Technology	Epoxy
Thixotropic Index	4.0
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	30000.0 mPa·s (cP)
Volume Resistivity	0.0005 Ohm cm