LOCTITE ABLESTIK QMI505MT

LOCTITE ABLESTIK QMI505MT, Rubberized epoxy, Die attach LOCTITE® ABLESTIK QMI505MT die attach paste is designed for attachment of integrated circuits and components to advanced metal and ceramic surfaces. A package or device manufactured with LOCTITE ABLESTIK QMI505MT will have good resistance to delamination and “popcorning” after exposure to reflow temperatures. Please refer to the TDS for alternate cure schedules.

• Electrically conductive
• Hydrophobic
• Stable at high temperatures
• Void-free bondline

Application Method	Dispense System
Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	72.0 ppm/°C
Color	Silver
Cure Type	Heat Cure
Density, Maximum Final	3.4 g/cm³
Extractable Ionic Content, Chloride (CI-)	20.0 ppm
Extractable Ionic Content, Fluoride (F-)	20.0 ppm
Extractable Ionic Content, Potassium (K+)	20.0 ppm
Extractable Ionic Content, Sodium (Na+)	20.0 ppm
Key Characteristics	Adhesion: Excellent Adhesion, Conductivity: Electrically Conductive, Conductivity: Thermally Conductive, Cure Speed: Very Fast, Dispensable, Dispensibility: Good Dispensibility, Filler: Ag Filled, Filler: Silver Filled, Modulus: Low Modulus, Pot Life: Long Pot Life
Number of Components	1 Part
Physical Form	Paste
RT Die Shear Strength, 7.5 x 7.5 mm Si die on Ag plated Cu leadframe	35.0 kg-f
Substrates	Ceramic, LeadFrame: Gold, LeadFrame: Silver
Technology	Epoxy
Tensile Modulus, DMA @ 25.0 °C	860.0 N/mm²
Thixotropic Index	4.8