LOCTITE ABLESTIK ATB 120U

LOCTITE ABLESTIK ATB 120U, Rubberized Epoxy, Die Attach LOCTITE® ABLESTIK ATB 120U adhesive film is formulated for use in wafer lamination processes. It combines process ease with the proven reliability.

• Thin bondline
• Non-conductive
• Fast cure
• Excellent gap filling ability

Adhesive Film Thickness	20.0 µm
Carrier Film Thickness	85.0 µm
Dicing Tape Diameter	8.0
Extractable Ionic Content, Chloride (CI-)	10.0 ppm
Extractable Ionic Content, Fluoride (F-)	10.0 ppm
Extractable Ionic Content, Potassium (K+)	10.0 ppm
Extractable Ionic Content, Sodium (Na+)	10.0 ppm
Hot Die Shear Strength	2.0 kg-f
RT Die Shear Strength	40.0 kg-f
Tensile Modulus, @ 250.0 °C	2.0 N/mm² (230.0 psi )
Wafer Diameter	8.0
Weight Loss, @ 300.0 °C	<1.0 %